Kingston HyperX T1 RAM

HyperX T1

Now equipped with the next-generation heat sink, HyperX T1 memory kit is Kingston's latest offering for the most exquisite overclocking memory product one could ask for. Featuring an all new heat sink construction, the HyperX T1 is capable of challenging the limits to deliver a new overclocking experience like never before.

Tri-channel HyperX T1 features:

• The 1.65V operating voltage enables stable overclocking to make Intel Core-i7 processors run faster with a longer lifecycle.
• All HyperX series are compatible with Intel XMP auto-overclocking function.
• A Memory Kit specifically optimized for Intel Core-i7 series processors.
• Exceptional clock and latency timing specifications to enhance overall system performance.
• Installing three memory kits will enable triple the amount of data to be transferred.
• A high capacity kit to offer comprehensive compatibility features for graphic/gaming applications; quenches your thirst for a performance upgrade.
• An all new heat sink design to achieve effective maintenance of speed while prolonging the memory lifecycle.

Choose 'X' Part Numbers For Intel XMP-Certified Memory

Looking to build the ultimate high-performance PC? Choose certified Intel® Extreme Memory Profile (XMP) memory modules for your rig. XMP-certified components are put through a series of rigorous tests to ensure the best possible user experience. Kingston's Intel XMP modules are easy to find — just look for an “X” at the end of the part number.

Triple Channel Memory Kit
Kingston Part Number	Description	Capacity	Latency Timing	Voltage
KHX1866C9AD3T1K3/6GX	DDR3, Non-ECC, Unbuffered DIMM, Intel X.M.P Profile 1 - DDR3-1600 Profile 2 - DDR3-1866	6GB Kit (3 - 2GB)	9-9-9 9-11-9	1.65V (VQPI=1.4V) 1.65V (VQPI=1.6V)
KHX1600C9D3T1K3/6GX	DDR3-1600, Non-ECC, Unbuffered DIMM, Intel X.M.P	6GB Kit (3 - 2GB)	9-9-9-27	1.65V
KHX1600C9D3T1BK3/12GX	DDR3-1600, Non-ECC, Unbuffered DIMM, Intel X.M.P	12GB Kit (3 - 4GB)	9-9-9-27	1.65V
KHX1600C9D3T1BK6/24GX	DDR3-1600, Non-ECC, Unbuffered DIMM, Intel X.M.P	24GB Kit (6 - 4GB)	9-9-9-27	1.65V

Dual channel HyperX T1 DDR3 features:

• Designed specifically for mainstream DDR3 PC platforms (Intel P45 Chipset, AMD Phenom II processors etc.).
• In addition to kits designed for maximum performance, the product is also available in different clock and latency timing combinations to satisfy the diverse needs of users.
• Installing two memory kits will enable double the amount of data to be transferred.
• Featuring a high efficiency heat sink that delivers a longer memory lifecycle under high voltage operations

Dual Channel Memory Kit
Kingston Part Number	Description	Capacity	Latency Timing	Voltage
KHX2133C9BD3T1K2/4GX	DDR3 Non-ECC, Unbuffered DIMM, Intel X.M.P Profile 1 - DDR3 1866 Profile 2 - DDR3 2133	4GB KIT (2 - 2GB)	9-11-9 9-11-10	1.65V
KHX1866C9D3T1BK2/8GX	DDR3-1866, Non-ECC, Unbuffered DIMM, Intel X.M.P Profile 1 = DDR3-1866 Profile 2 = DDR3-1600	8GB Kit (2 - 4GB)	9-11-9-27 9-9-9-27	1.65V
KHX1866C9D3T1K2/8GX	DDR3-1866, Non-ECC, Unbuffered DIMM, Intel X.M.P Profile 1 = DDR3-1866 Profile 2 = DDR3-1600	8GB Kit (2 - 4GB)	9-11-9-27 9-9-9-27	1.65V
KHX1600C8D3T1K2/4GX	DDR3-1600, Non-ECC, Unbuffered DIMM, Intel X.M.P.	4GB Kit (2 - 2GB)	8-8-8-24	1.65V
KHX1600C9D3T1K2/8G	DDR3-1600, Non-ECC, Unbuffered DIMM	8GB Kit (2 - 4GB)	9-9-9-27	1.65V
KHX1600C9D3T1K2/8GX	Intel X.M.P, DDR3-1600, unbuffered DIMM	8GB Kit (2 - 4GB)	9-9-9-27	1.65V

Illustration of heat sink features:



With its large heat dissipating surface, the new T1 heat sink delivers even better heat dispersion efficiency. This kit will provide better cooling regardless of your cooling method (i.e. convection or cooling by means of a dedicated fan). For systems that are required to run at full speed over prolonged periods of time, the T1 heat sink makes an excellent component for improved performance.

† The information below will help illustrate the appropriate settings when adjusting the memory timings in the motherboard BIOS for optimum performance. Please note that these settings may vary depending on motherboard make/model or BIOS update.

Sample:

Part Number	Timings
KHX2333C9D3T1FK3/3GX	9-11-9-27

Timing	Definition	Abbreviations	What it does
9	CAS Latency	CL	Delay between activation of row and reading of row
11	RAS to CAS (or Row to Column Delay)	tRCD	Activates row
9	Row Precharge Delay (or RAS Precharge Delay)	tRP/tRCP	Deactivates row
27	Row Active Delay (or RAS Active Delay, or time to ready)	tRA/tRD/tRAS	Number of clock cycles between activation and deactivation of row
1	Command Rate	CMD Rate	Delay between chip select and command

Notice: All Kingston products are tested individually to meet our published specifications. Not all systems or motherboard configurations will operate at these published specifications. Optimal settings for individual system configurations may be less than the published HyperX module speeds and timings. Performance from installing additional kits is not guaranteed. Remove existing memory before adding HyperX to achieve optimal performance. Overclocking the CPU or the Memory Bus may result in damage to computer components. Kingston does not recommend that any user attempt to run their systems faster than OEM or system published specifications. Please refer to your OEM, system or other component vendors technical specifications for any additional information.